Fully Scalable Toolkit Allow Users To Easily Interconnect Industrial Software Systems

Single Fully Scalable Toolkit Enables Connectivity across Products and Platforms

Honeywell Process Solutions (HPS) today announced that it has introduced the Matrikon OPC Unified Architecture (OPC UA) Software Development Kit (SDK), a single fully scalable toolkit to allow users to quickly and easily interconnect industrial software systems, regardless of the platform, operating system or size.

Widespread adoption of the Industrial Internet of Things (IIoT) and Industrie 4.0 continues to drive demand for open and secure connectivity between devices (machine-to-machine or M2M) and edge to cloud solutions. With OPC UA identified as a key data connectivity standard, vendors are working to enable their new and existing products with OPC UA to compete in the new IIoT/Industrie 4.0 landscape.

“In addition to minimising production costs, the Matrikon OPC UA SDK requires the least amount of memory in the industry and runs as efficiently as possible to leave sufficient CPU resources for correct device functionality,” said Elgonda la Grange, director for HPS’ Advanced Solutions software products. “Automation vendors will see the Matrikon OPC UA SDK as an effective solution for deploying IIoT connectivity across their product lines.”

Unlike other OPC UA toolkits, the Matrikon OPC UA SDK is able to work equally well in small embedded environments as well as in large PC-based applications. This scalability makes it a one-stop-shop solution for companies that want to OPC UA enable multiple product lines ranging from networked discrete sensors and actuators to programmable controllers and beyond.

With its “server-in-a-box” design, the Matrikon OPC UA SDK provides vendors with a fast, easy method of implementing optimized, highly reliable OPC UA products without requiring their developers to be OPC UA experts – allowing vendors to confidently take their OPC UA enabled products to market faster.