High-Speed Photocoupler for Industrial Automation Launched

Phil Black - PII Editor 04/11/2015

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Ultra-thin photocoupler in SO6L package delivers creepage and clearance distance of 8mm and isolation voltage of 5000Vrms

Toshiba has launched a new photocoupler featuring high-speed data transmission (20Mbps) and a very thin package that offers protection against extreme operating temperatures. The TLP2768A is ideally suited for use in high-speed communication interfaces for industrial automation.

Contained within a new SO6L package, which guarantees a clearance and creepage distance of 8mm, the TLP2768A also offers a maximum height of just 2.3mm, which means a thickness reduction of approximately 45%, when compared to the previous SDIP6 package.

With an operating temperature range of -40°C to 125°C, the TLP2768A meets the demand for devices to be used in increasingly compact industrial equipment that contains a greater density of components and therefore has higher internal temperatures.

The TLP2768A integrates a high-reliability infrared LED in its input side, and has an open-collector output type high-speed Photo-IC in its output side that is capable of data transmission at 20Mbps and of supporting both 3.3V and 5V power supplies. The SO6L package just measures 10mm x 3.8mm x 2.1mm.